Enclosure mounted heat sink
US6226184A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1999 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Oct 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink for a heat generating component of a computer system, such as a central processing unit (CPU), attaches to the computer system enclosure. The heat sink may be pressed against the component to establish thermal contact with the component. Because the heat sink attaches to the computer system enclosure and not the component, the component socket, or a circuit board; the heat sink may be unusually shaped and large, while still allowing easy access to the components mounted within the computer system enclosure. Removing the enclosure panel on which the sink is attached may allow easy access to the components within the computer enclosure. The heat sink may be particularly useful in computer systems that use only natural convection cooling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.