Temperature controlled chemical mechanical polishing method and apparatus
US6227939A · kind A · utility
9Cited by
7References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2000 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Jan 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method for producing more uniformly polished wafers using chemical mechanical polishing (CMP). The present invention recognizes that wafer temperature is important in achieving uniform polishing. Mechanisms are disclosed for regulating carrier and carrier plate temperatures and thereby regulating the temperature of an attached wafer. Mechanisms are also disclosed that insulate a wafer, at least to some extent, from undesired heat sinks or heat sources.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.