Heat treatment system using ring-shaped radiation heater elements
US6228174A · kind A · utility
9Cited by
4References
20Claims
0Family size
Inventor
Key dates
| Filing date | Jan 11, 2000 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Jan 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/912
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a heat treatment system for heating a semiconductor wafers, around a processing chamber is defined an enclosed heating chamber that can be either filled with gases or evacuated. The heater elements consist of halogen infrared lamps received in concentric grooves having a mirror surface. It is therefore possible to achieve a favorable heat insulation which contributes to a high heat efficiency. When the heating chamber is filled with gases or air, it is possible to achieve a controlled rapid cooling of the processing chamber, and this contributes to a short turnaround time of the heat treatment system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.