Electroplating apparatus
US6228230A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Apr 19, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/22
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for electroplating small parts comprises an electroplating bath for holding an electrolyte and electroplating anodes. The apparatus includes a container having at least one screened parts compartment for holding the parts to be electroplated, and incorporates an electrically conductive screen as its base portion, on which the parts are settled. The conductive screen is adaptable to be connected to the negative pole of a power supply to function as the cathode. A pump circulates freshly ionized electrolyte into the parts compartment and directs a flow of the electrolyte to periodically tumble the parts in the parts compartment. Thereafter, the parts are shaken by a shaker to level the parts to maximize the surface and electrical contact between the parts and the screen when they are settled on the screen. In alternative embodiments of the invention, the container can be of perforated panel construction. Also, the container can include a divider to partition the container into a plurality of parts compartments for electroplating a variety of different parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.