Printed wiring board and method for manufacturing the same
US6228466A · kind A · utility
155Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Jun 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed wiring board which has a conductor circuit (12) on an insulating substrate (10) and a surface insulating layer (14) formed on the surface of the substrate (10) including the surface of the conductor circuit (12). Part of the conductor circuit (12) has an exposed conductor section (120) having an exposed surface, and a surface insulating layer (140) around the conductor section (120) forms a recessed section at the same level of the surface of the conductor section (120) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.