Flip-chip resin-encapsulated semiconductor device
US6228688A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1998 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Feb 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a resin-encapsulated semiconductor device, which includes the steps of, mounting a semiconductor element facedown on a substrate provided with a wiring circuit with a main surface of the semiconductor element being faced to the substrate, positioning the substrate bearing the semiconductor element in a mold together with a sealing resin, and applying a pressure onto the sealing resin to move the sealing resin to a space between the semiconductor element and the substrate, to the sides of the semiconductor element and to the bottom surface of the semiconductor element, thereby sealing the semiconductor element with the sealing resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.