Process for manufacturing semiconductor integrated circuit device
US6228704A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Mar 31, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/09
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To provide a process for manufacturing a semiconductor integrated circuit device in which ion implantation of an embedded diffused layer for forming triple-well and oxide film etching for forming two types of gate oxide films having different thicknesses is performed by only one photoetching step, the process being capable of reducing the manufacturing cost, and speeding up the circuit operation by making the gate oxide film of the peripheral unit thinner than that of the I/O circuit unit. A resist mask having a given width ranging in a given range which will be formed on the silicon oxide film is formed in a gate forming area in a region where an embedded N-type layer will be formed in a P-type silicon substrate and it is desired to make the thickness of the gate oxide film thicker. The embedded N-type layer is also formed even immediately below the resist mask by conducting an ion implantation at a given energy via the resist mask. The oxide film is etched out by using the resist mask as a mask and the gate oxide film is then formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.