Thermal connection system for modular computer system components
US6229704A · kind A · utility
26Cited by
23References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Oct 19, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and system of thermally connecting internal components of a computer system to a heat sink. The components are arranged as modular units, each having at least one component heat conductor extending from it. For each component heat conductor, an arterial heat conductor extends from the heat sink. Each module heat conductor is attached orthogonally to its associated arterial heat conductor, using a special thermal connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.