Flip-chip mount board and flip-chip mount structure with improved mounting reliability
US6229711A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 25, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Feb 25, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip mount board includes a circuit board provided with a plurality of conductor patterns to which a plurality of bumps provided on an electronic component can be connected via a connection medium provided on the conductor patterns. The conductor pattern includes at least one wiring pattern and a connection pad, the wiring pattern serves as an interconnection, the connection pad is provided at a position corresponding to one of the bumps, the at least one wiring pattern and the connection pad are provided in an integrated manner, and a width (W1) of the connection pad is formed so as to be greater than a width (W2) of the wiring pattern (W1>W2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.