High temperature stability sensor contact, method for the production thereof
US6231348A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Nov 5, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Multiple contacts are provided in an electrical contacting arrangement of a sensor element, and the sensor element has a connection-side section with contact points, or contact pads, which are each integrally bonded to a corresponding contact. Each of the multiple contacts, at least on the section in contact with the contact point on the sensor element, has a layer by which the integral bond is formed between the contact and the contact point on the sensor element. The contacts are joined to the corresponding contact points on the sensor element by diffusion soldering or diffusion welding. Each contact has a curved intermediate section which compensates for thermal and/or mechanical expansion and movements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.