Patent · US Expired

High temperature stability sensor contact, method for the production thereof

US6231348A · kind A · utility

9Cited by
15References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 5, 1998
Grant dateMay 15, 2001
Priority date
Expiry dateNov 5, 2018

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R43/02
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Multiple contacts are provided in an electrical contacting arrangement of a sensor element, and the sensor element has a connection-side section with contact points, or contact pads, which are each integrally bonded to a corresponding contact. Each of the multiple contacts, at least on the section in contact with the contact point on the sensor element, has a layer by which the integral bond is formed between the contact and the contact point on the sensor element. The contacts are joined to the corresponding contact points on the sensor element by diffusion soldering or diffusion welding. Each contact has a curved intermediate section which compensates for thermal and/or mechanical expansion and movements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.