Electroplating process
US6231619A · kind A · utility
2Cited by
7References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1995 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Dec 11, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then dried by passing the substrates between opposing resilient rollers and preferably passed an air knife.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.