Method for laminating boards
US6231705A · kind A · utility
11Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Sep 25, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/26
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for laminating boards includes placing boards with a narrow gap therebetween, inserting an adhesive injection nozzle the gap, discharging of adhesive from the nozzle into the gap so that the discharged adhesive makes into contact with the two boards, continuing discharging the adhesive while the boards are being rotated in a planar direction thereof so that the adhesive is placed in a loop within the gap, retreating the nozzle from the gap, and narrowing the gap between the boards so that the adhesive is spread throughout the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.