Method of forming coatings
US6231989A · kind A · utility
38Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Nov 20, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coating is formed on a substrate by depositing a solution comprising a resin containing at least 2 Si--H groups and a solvent in a manner in which at least 5 volume % of the solvent remains in the coating after deposition followed by exposing the coating to an environment comprising a basic catalyst and water at a concentration sufficient to cause condensation of the Si--H groups and evaporating the solvent from the coating to form a porous network coating. The method of the invention is particularly useful for applying low dielectric constant coatings on electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.