Dielectric ceramics
US6232251A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Sep 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Dielectric ceramics comprising a diopside oxide crystal phase, at least one kind of crystal phase selected from the group consisting of a quartz crystal phase and a composite oxide crystal phase containing Ti and Mg or Zn, and a glass phase of an amount of not larger than 30% by weight, said dielectric ceramics having a coefficient of thermal expansion of not smaller than 5.5 ppm/.degree. C. at room temperature to 400.degree. C. and a dielectric loss of not larger than 30.times.10.sup.-4 at 60 to 77 GHz. The ceramics can be obtained by the co-firing with a low-resistance metal such as copper or silver, and can be advantageously used for the production of wiring boards to which the signals of particularly high frequencies are applied. The ceramics has a large coefficient of thermal expansion which can be brought close to the coefficient of thermal expansion of the semiconductor element such as of GaAs or of the printed board. The wiring board produced by using the ceramics effectively prevents breakage in the mounting portion of the wiring board that is caused by a difference in the thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.