Topical pharmaceutical compositions for healing wounds
US6232341A · kind A · utility
5Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1998 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Oct 5, 2018 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61P43/00
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
The present invention provides a topical pharmaceutical composition for wound healing, which comprises (a) borneol and (b) bismuth subgallate in effective amounts. The topical pharmaceutical composition is capable of enhancing wound healing with minor irritations to injured skin, and preventing formation of scars or granulation tissues so as to help regenerate the skin with normal tenderness and appearances.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.