Patent · US Expired

Pressure sensitive conductive adhesive having hot-melt properties and biomedical electrodes using same

US6232366A · kind A · utility

144Cited by
33References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 9, 1999
Grant dateMay 15, 2001
Priority date
Expiry dateJun 9, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/1462
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A skin-compatible, hot-melt processible, pressure sensitive adhesive is disclosed. A thermo-reversible cross-linking is achieved, permitting advantages in processibility and the reduction of waste.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.