Process for producing wire connections on an electronic component assembly carrier made by the process

US6232561A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Joachim Schmidt · Schlangen, DE
• Jens Sabotke · Hildesheim, DE
• Frank Hauschild · Berlin, DE

Key dates

• Filing date: Jan 28, 1998
• Grant date: May 15, 2001
• Expiry date: Jan 28, 2018

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Electronic components on an assembly carrier are connected with conductor paths on the assembly carrier by welding a first ball-shaped end of a first wire to an electronic component, welding a first ball-shaped end of a second wire to the conductor path, and welding second broadened ends of both wires to a connection surface located between the electronic component and the conductor path.