Hybrid integrated circuit device
US6232562A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Sep 28, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hybrid integrated circuit device is provided which suppresses lowering of the inductance value of a mounted coil component. A hybrid integrated circuit device according to the present invention has such a structure that a wiring pattern is provided on at least one main face of a substrate, a laid core type coil component is mounted on at least one main surface of the substrate, and a conductor pattern including a ground pattern is provided at least either on a main face opposite to the surface of the substrate upon which the laid core type coil component is mounted or in an interior of the substrate. In particular, the hybrid integrated circuit device has a configuration such that a magnetic flux passing window, having an absence of ground pattern, is provided in an orthographic projection area corresponding to a winding portion of the coil component in the conductor pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.