Lead frame for semiconductor device
US6232651A · kind A · utility
9Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | May 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for semiconductor devices including a metal substrate having inner leads and outer leads, a nickel thin layer formed on the metal substrate, an outer layer formed of palladium or a palladium alloy on the nickel thin layer, and a protection layer formed of gold or platinum between the nickel thin layer and the outer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.