TSOP type semiconductor device
US6232653A · kind A · utility
2Cited by
8References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1999 |
| Grant date | May 15, 2001 |
| Priority date | — |
| Expiry date | Mar 17, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A TSOP type semiconductor device having a LOC structure employing a copper (alloy) type frame prevents resin cracks that occur in a reliability test such as a temperature cycle test. The TSOP type semiconductor device has narrower common inner leads where a resin crack would be likely to occur first, and has a thinner chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.