Patent · US Expired

Encapsulation of printed circuit boards

US6233155A · kind A · utility

7Cited by

9References

6Claims

0Family size

Assignee

Telefonaktiebolaget LM Ericsson (Publ) · SE

Inventors

Erik Möster · Malmö, SE
Paul Larsson · Staffanstorp, SE
Mats Olsson · Hagfors, SE
Olof Simonsson · Lund, SE
Mats Larsson · Baden, CH
Rafael Portela · Malmö, SE

Key dates

Filing date	Jun 3, 1999
Grant date	May 15, 2001
Priority date	—
Expiry date	Jun 3, 2019

Classification

Technology area (CPC E)Fixed Constructions
CPC primaryE05Y2900/208
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A housing for electronic components is injection molded as a unitary, single-piece, monolithic piece, and includes a front cover, a back cover, and a living hinge. Electronic components, including a PCB, are contained within the housing. A cosmetic cover is secured to the housing over the living hinge, which protrudes from the housing, to make the housing more appealing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.