Processes for manufacturing flexible printed wiring boards
US6233821A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1999 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Mar 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.