Patent · US Expired

Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler

US6234687A · kind A · utility

49Cited by
11References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 27, 1999
Grant dateMay 22, 2001
Priority date
Expiry dateAug 27, 2019

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG02B6/421
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

An assembly is described that consists of a gallium arsenide die chip and a fiber optic coupler bonded together about their respective mating surfaces. The chip includes laser light emitters. The fiber optic coupler has fiber optic light transmitters that require precise alignment with the laser light emitters of the chip about their mating surfaces. After alignment of the emitting/receiving and transmitting elements, the mating surfaces of the chip and coupler are bonded together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.