Grinding machine for forming chip-producing cutting tools
US6234881A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 1998 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Aug 6, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B5/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Cylindrical surface regions (1) of cutting tools (2, 21), such as drills, boring tools, reamers or the like, that is, cutting tools formed with chip removal grooves or flutes or recesses (6), are ground by engaging a rotary cutting disk (3) against the ribs (5) between the chip removal grooves. The cutting tool (2, 21), during the grinding operation, is rocked or oscillated to-and-fro (24) about its longitudinal axis (18) in such a manner that the cutting disk (3) covers the cylindrical surface portion in circumferential direction at least several times. The cutting disk (3) also may rock or oscillate about an axis perpendicular to the axis (7) of rotation of the cutting disk (3). Suitable frequencies are between about 0.1 Hz and 1 Hz, preferably 0.5 Hz, for the rocking movement of the cutting tool (2, 21), with the oscillatory movement of the grinding disk being higher than that of the cutting tool, and for example between 1 Hz and 10 Hz. After grinding a circumferential surface region, the cutting tool can be indexed rapidly to the next surface region to be ground, so that time loss due to the grinding disk passing over a groove or flute (5) is a minimum, and vibration and shock …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.