Method for separating solder and solder oxides
US6235208A · kind A · utility
10Cited by
4References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2000 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Oct 10, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering apparatus includes a solder wave shape forming means for melting solder and forming a solder wave shape, and a separating agent dusting means for dusting solder oxides with a separating agent which separates solder and solder oxides. The separating agent is any one selected from the group consisting of offal, cereal grain or flour, bean flour, seed grain or flour, soybean-cake flour, and peanut hull flour, or a combination thereof, as well as an agent and a method of separating solder and solder oxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.