Radiation sensitive resin composition
US6235446A · kind A · utility
11Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1998 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Aug 14, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation sensitive resin composition comprising (A) a copolymer possessing recurring units of the formulas (1), (2), and (3), ##STR1## which turns alkali soluble in the presence of acid and (B) a photosensitive acid generator. Because the composition can resolve line-and-space patterns, isolated patterns, and contact hole patterns with satisfactory appearance and high resolution, it is useful as a chemically amplified positive resist for use in the manufacture of semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.