Adhesive silicone sheet, method for the preparation thereof and semiconductor devices
US6235862A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1998 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Apr 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.