Temperature compensated microelectromechanical structures and related methods
US6236139A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1999 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Feb 26, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2001/0042
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrat…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.