Thermal printhead and protective cover used for the same
US6236422A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2000 |
| Grant date | May 22, 2001 |
| Priority date | — |
| Expiry date | Jul 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/345
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A protective cover (9) is provided which is used for a thermal printhead including a heat sink plate (1) formed with a plurality of fixing holes (10), a head substrate (2), and a circuit board (3). The heat sink plate (1) is formed with a groove (1a) which divides the upper surface of the heat sink plate (1) into a first region (1b) and a second region (1c). The head substrate (2) is provided with a heating resistor (4) and drive ICs (5). The drive ICs (5) are covered with a coating resin layer (6). The circuit board (3) is formed with through-holes (11). The protective cover (9) includes a main body (9a) having an obverse surface and a reverse surface, and a plurality of pins (12) extending from the reverse surface. Each of the pins (12) is formed with a slit (12a), which facilitates press-fitting of the pin (12) into a respective one of the fixing holes (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.