Patent · US Revoked

Apparatus for supporting and tensioning a stencil

US6237489A · kind A · utility

0Cited by
8References
19Claims
0Family size

Inventor

Key dates

Filing dateJan 13, 2000
Grant dateMay 29, 2001
Priority date
Expiry dateJan 13, 2020

Classification

  • Technology area (CPC —)General

Abstract

A support and tensioning frame for a stencil to enable solder paste to be applied to printed circuit boards and other electronic substrates includes a support frame engaged with at least two opposed mounting members. Each mounting member includes at least one projection for engaging an aperture in a stencil to mount the stencil under tension. A permanent-biasing mechanism engages one or more of the mounting members to place the stencil under tension. A second biasing mechanism engages the mounting member to provide a bias opposite that of the permanent-biasing mechanism to facilitate release of a mounted stencil.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.