Cooling module including a pressure relief mechanism
US6237682A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1999 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Apr 30, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure relief mechanism (200), and a shearing surface (201). The housing (105) includes a cooling material (121) disposed therein. The pressure relief mechanism (200) is disposed within the housing (105) and covers the opening (203) to provide a seal that seals the housing (105). The shearing surface (201) is effective to break the seal upon exceeding a predetermined pressure within the housing (105).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.