Polishing compound and a polishing method for silicon wafer
US6238272A · kind A · utility
6Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1999 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Sep 3, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention is a polishing compound comprising a colloidal solution of silicon oxide to which an alkaline component and an acid component are added in order to have a buffering action, wherein said alkali component is a quaternary ammonium whose carbon number per one molecular is smaller than 12, and said acid component is at least one selected from the group composed by carbonic acid, boric acid and silicic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.