Abrasive cutter containing diamond particles and a method for producing the cutter
US6238280A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1999 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Sep 27, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C2026/005
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An abrasive cutter formed of at least one diamond particle, preferably at least one mono-diamond crystal and metallic binder material distinguished by the fact that the diamond particle (D) has a size of about 50 .mu.m to about 500 .mu.m and each diamond particle (D) is enclosed by a coating (H) produced in a fluidized bed with the coating having a wall thickness of about 10 .mu.m to about 200 .mu.m. The volume of the coating (H) constitutes at least 30% of the volume of the diamond particles (D) in the fully consolidated state following individual sintering of the coated diamond particles (D, H). The abrasive cutters can be applied directly onto an abrasive tool. Further they can be processed to form composite cutters or cutting segments. In the method of forming the abrasive cutter, the diamond particle (D) is brought into a fluidized bed reactor and enclosed in a metallic coating (H). Coated diamond particle (D, H) can be processed into larger cutters or segments in each case individually sintered and fixed directly on an abrasive tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.