Ceria powder
US6238450A · kind A · utility
104Cited by
7References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A polishing slurry, useful in optical or CMP applications, comprises a ceria with a BET surface area of at least 10 m.sup.2 /gm. The slurry may be made by subjecting a commercial ceria slurry comprising agglomerates to a mechano-chemical treatment at a pH of from 9 to 11 using media that are low purity alpha alumina or zirconia. Preferred slurries maintain a positive surface charge at all pH values. CMP slurries preferably comprise in addition an anionic surfactant to aid in removal of surface residues.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.