Patent · US Expired

Method of fabricating a homogeneous wire of inter-metallic alloy

US6238498A · kind A · utility

3Cited by
7References
6Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 16, 1999
Grant dateMay 29, 2001
Priority date
Expiry dateMar 16, 2019

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC21D8/065
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for fabricating a homogeneous wire of inter-metallic alloy comprising the steps of providing a base-metal wire bundle comprising a metal, an alloy or a combination thereof; working the wire bundle through at least one die to obtain a desired dimension and to form a precursor wire; and, controllably heating the precursor wire such that a portion of the wire will become liquid while simultaneously maintaining its desired shape, whereby substantial homogenization of the wire occurs in the liquid state and additional homogenization occurs in the solid state resulting in a homogenous alloy product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.