Ball-grid array IC packaging frame
US6239383A · kind A · utility
14Cited by
10References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 5, 1999 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Apr 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball-grid array (BGA) IC packaging frame of the invention includes a plurality of ball-grid array tin balls formed on the rear surface of a BGA package and a plurality of supporting pads formed on the surrounding of the rear surface. The designed supporting pads can efficiently prevent a non-contact soldering and a short circuit when a BGA IC is mounted on a PCB during manufacturing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.