Lead frame with heat spreader and semiconductor package therewith
US6239487A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 1998 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Dec 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame for a chip package includes a heat spreader and permits the mounting of various sized chips on the same sized lead frame. The lead frame includes a plurality of leads having outer portions and inner portions; a heat spreader having a rim portion adapted to be attached to ends of the inner portions of the leads and a projecting portion that projects between the ends of the inner portions of the leads such that an upper surface of the projecting portion is in approximately the same plane as an upper surface of the inner portions of the leads. An insulative adhesive may be used to attach the ends of the inner portions of the leads to the rim portion of the heat spreader. Also, insulation members may be attached to upper surfaces of the ends of the inner portions of the leads for receiving a large size chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.