Method for mounting a semiconductor chip on a substrate, and semiconductor device adapted for mounting on a substrate
US6239488A · kind A · utility
7Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2000 |
| Grant date | May 29, 2001 |
| Priority date | — |
| Expiry date | Mar 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is adapted for mounting on a substrate that has a chip-mounting region provided with a plurality of solder points. The semiconductor device includes a semiconductor chip having a pad-mounting surface provided with a plurality of bonding pads which are disposed on the pad-mounting surface at locations that are offset from locations of corresponding ones of the solder points on the chip-mounting region. Conductive bodies are formed on the pad-mounting surface to establish the required electrical connection among the bonding pads and the corresponding ones of the solder points.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.