Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board
US6240634A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Dec 14, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of production of a multichip package module, rough-pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough-pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine-pitch bare chips individually, in order to produce the multichip package module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.