Reflow soldering self-aligning fixture
US6241141A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2000 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Mar 22, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improvement in a reflow soldering apparatus for bonding a connector element such as flexible circuitry or a pin type input/output (I/O) connector to a printed circuit board (PCB) is disclosed wherein a fixture tray included in the apparatus automatically aligns or self levels itself with the heating bars, or thermodes, of the apparatus. The fixture tray includes a body for supporting the connector/PCB assembly and cylindrical rods extending from the body. The rods are rotatably supported in corresponding grooves on the surface of the fixture tray table. As a thermode is pressed onto the connector/PCB assembly, the fixture tray rotates about its axis of rotation until the work area is aligned with the thermode. In a sandwich type soldering application including a pair of thermodes for simultaneously soldering opposite sides of a connector/PCB assembly, the fixture tray rests on an upper plate of a tray table supported by resilient means such as springs. Pressing an upper thermode onto the upper work surface of the connector/PCB assembly causes the work surface to rotate into alignment with the thermodes, and further causes the upper plate to descend until the bottom work surface …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.