Process for manufacturing a sensor arrangement for temperature measurement
US6241146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Jul 12, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process is provided for manufacturing a sensor arrangement for temperature measurement with a temperature-sensitive measuring resistance which has a thin, metal resistance layer electrically insulated toward the outside, and exposed contact surfaces on a ceramic substrate. The contact surfaces are connected electrically conducting and directly mechanically fast with high temperature-resistant conductor paths electrically insulated from one another on a ceramic carrier element. The measuring resistance is bonded and attached by application to and subsequent firing on a carrier element prepared prior to outfitting. A platinum-containing thick film conducting paste serves as a means for attachment and bonding. Contact surfaces for connecting a plug or cable are arranged at the end of the carrier element facing away from the measuring resistance. The temperature sensor, a standard component in the form of a flat measuring resistance, is applied to the ceramic carrier element without the use of wires as an SMD component. The sensor arrangement manufactured by the process is suited for temperature measurements even above 400.degree. C. The process is economical in that it uses a few st…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.