Apparatus and method for polishing a substrate
US6241591A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment, a polishing apparatus (10) includes a retaining ring (12), a pressure ring (16), a first seal (18), and a second seal (20). The retaining ring (12) is movably attached to the pressure ring (16) to create a uniform pressure distribution across the retaining ring (12). In addition a positive fluid pressure is applied to the first seal (18) and the second seal (20) to create the uniform pressure distribution across the retaining ring (12). The uniform pressure distribution across the retaining ring (16) allows a semiconductor substrate (51), polished with the polishing apparatus (10), to have a reduced edge exclusion, and thus increased die yield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.