Printed wiring board and method for manufacturing the same
US6242079A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer printed wiring board 52 comprising an underlayer conductor circuit 26, an interlaminar resin insulating layer 37 formed on the underlayer conductor circuit 26, an upper layer conductor circuit 44 formed on the interlaminar resin insulating layer 37 and a via-hole 51 connecting the underlayer conductor circuit 26 to the upperlayer conductor circuit 44. The multilayer printed wiring board according to the invention has a roughened surface 35 by treating the underlayer conductor circuit 24 with an etching solution containing copper(II) complex and an organic acid, wherein the underlayer conductor circuit 26 is connected to the via-hole 51 through the roughened surface 35. In the multilayer printed wiring board according to the invention, the adhesion property between the underlayer. conductor circuit and the interlaminar resin insulating layer and the adhesion property between the underlayer conductor circuit and the via-hole conductor are improved, and the high connection reliability in the via-hole portion is ensured in the heating or the heat cycle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.