Shape deposition manufacturing of microscopic ceramic and metallic parts using silicon molds
US6242163A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1999 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/034
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Micro-Mold Shape Deposition Manufacturing (.mu.-Mold SDM) is a method for fabricating complex, three-dimensional microstructures from layered silicon molds. Silicon wafers are etched using conventional silicon-processing techniques to produce wafers with surface patterns, some of which contain through-etched regions. The wafers are then stacked and bonded together to form a mold, which is filled with part material. In one embodiment, the part material is a ceramic or metallic gelcasting slurry that is poured into the mold and solidified to form a part precursor. The mold is removed, and the precursor is sintered to form the final part. The gelcasting material may also be a polymer or magnetic slurry, in which case sintering is not needed. The mold can also be filled by electroplating a metal into it; if necessary, each layer is filled with metal after being bonded to a previously filled layer. Patterned silicon wafer layers may also be combined with macroscopic wax layers formed by Mold SDM to create macroscopic parts with some microscopic parts or features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.