Touch calibration system for wafer transfer robot
US6242879A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2000 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Mar 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67778
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for automatically calibrating the precise positioning of a wafer handling robot relative to a target structure is disclosed. The apparatus comprises a machine controller connected to robot having an end-effector with three degrees of movement. The controller has a memory with stored rough distance and geometrical data defining the general location of structural features of the target structure. The robot is programmed to move toward the target structure in a series of sequential movements, each movement culminating with the robot end-effector touching a preselected exterior feature of the target structure. Each touching of the end-effector is sensed and provides data for the controller which then calculates the precise location of the target structure. The data accumulated during a series of touching steps by the robot end-effector is utilized by the controller to provide a precise calibrated control program for future operation of the robot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.