Centralized cooling interconnect for electronic packages
US6243269A · kind A · utility
26Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1998 |
| Grant date | Jun 5, 2001 |
| Priority date | — |
| Expiry date | Dec 29, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for centralizing heat dissipation on printed circuit boards is disclosed. The printed circuit board materials are used to thermally conduct heat from a circuit that generates heat to a heat sink. The heat sink can be the layer on the printed circuit board, conductive paths on a layer of a printed circuit board, or the layers of the printed circuit board can be used to thermally couple the heat generating circuit to an external, remote heat sink for heat dissipative purposes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.