Apparatus for supplying solder balls
US6244788A · kind A · utility
Inventor
Key dates
| Filing date | Jun 2, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus is provided for supplying solder balls to a receptacle. The apparatus includes a reservoir for storing the solder balls and a flow path. The flow path includes a first end connected to and in fluid communication with the reservoir and a second end for supplying the solder balls to the receptacle. The apparatus includes a flow actuator in fluid communication with the flow path to actuate the flow of the solder balls from the reservoir through the flow path to the receptacle. A trap is disposed in the flow path for trapping the solder balls and stopping the flow of the solder balls to the receptacle when the flow actuator is not actuated. Related methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.