Method and apparatus for pad removal and replacement
US6244941A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for facilitating the removal and replacement of polishing pads utilized in the process of polishing and planarizing workpieces such as semiconductors where the polishing machine employed includes a rotatable platen. The apparatus for facilitating the removal and replacement of polishing pads includes a top plate for securing a polishing pad thereto and means for removably mounting the top plate to the rotatable platen in the polishing machine. Means for removably mounting the top plate to the rotatable platen preferably includes a plurality of electromagnetic elements embedded within the top surface of the rotatable platen and means for activating and deactivating the electromagnetic elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.