Circuit wiring system circuit wiring method semi-conductor package and semi-conductor package substrate
US6245599A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The primary objective of the present invention is to select a connecting combination of the plurality of solder ball connection pads and the plurality of wire bond pads, and generate an optimum wiring candidate. For this objective, the wiring pattern generation unit generates a wiring pattern as the information for specifying an in-area wiring route to be wired in each row and an in-area wiring route to be connected to the next row among the solder ball connection pad area closer to the wire bond pad area, based on the design conditions of the wiring route stored in the design condition memory. Then, the wiring plan generation unit generates a wiring plan laying out the plurality of wiring routes by combining the wiring patterns generated for each row, and the wiring rule check unit selects some of the generated wiring plans suited for the wiring rules and generates the plurality of wiring candidates. Furthermore, the quality rating unit rates the generated wiring candidates and selects the best wiring candidate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.