Spherical shaped semiconductor integrated circuit
US6245630A · kind A · utility
29Cited by
17References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 29, 1998 |
| Grant date | Jun 12, 2001 |
| Priority date | — |
| Expiry date | May 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/947
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A spherical shaped semiconductor integrated circuit ("ball") and a system and method for manufacturing same. The ball replaces the function of the flat, conventional chip. The physical dimensions of the ball allow it to adapt to many different manufacturing processes which otherwise could not be used. Furthermore, the assembly and mounting of the ball may facilitates efficient use of the semiconductor as well as circuit board space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.